发明名称 ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive material which facilitates connection between electrodes when used for the connection between the electrodes in a connection structure, can enhance conduction reliability and can further enhance shock resistance characteristics of the connection structure against a shock such as a fall or vibration. <P>SOLUTION: The anisotropic conductive material contains conductive particles 1, and a binder resin. The conductive particle 1 includes a resin particle 2, and a conductive layer 3 covering the surface 2a of the resin particle 2. At least the outer surface layer of the conductive layer 3 is a solder layer 5. A compression modulus of the conductive particle 1 when compressed by 20% is 1000 N/mm<SP POS="POST">2</SP>or more and 8000 N/mm<SP POS="POST">2</SP>or less. A compression recovery rate of the conductive particle 1 is 20% or more and 90% or less. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012156127(A) 申请公布日期 2012.08.16
申请号 JP20110288234 申请日期 2011.12.28
申请人 SEKISUI CHEM CO LTD 发明人 ISHIZAWA HIDEAKI;KOBAYASHI HIROSHI;MAHARA SHIGEO
分类号 H01B1/22;C09J11/04;C09J11/06;C09J201/00;H01B1/00;H01R11/01 主分类号 H01B1/22
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