| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance handleability of a laminate used for manufacturing a flexible circuit board while enhancing flexibility and anti-bending properties at a part to be bent of the flexible circuit board. <P>SOLUTION: In a method of manufacturing a flexible circuit board, a laminate including an insulation layer 2, and a conductor layer consisting of a polycrystalline metal composing a wiring layer and arranged on a first surface 2a of the insulation layer 2 is produced at first. Subsequently, the conductor layer is patterned to form a spare wiring layer 31. Thereafter, at least a part of the spare wiring layer 31 is heated. Consequently, the average value of maximum length of metal crystal grains, in the thickness direction of the spare wiring layer 31, increases in at least a part of the spare wiring layer 31 when compared with that before heating, and the spare wiring layer 31 becomes a wiring layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
