发明名称 HIGH-FREQUENCY SEMICONDUCTOR MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a high-frequency semiconductor module capable of adjusting a matching circuit by observing a matching state between stages. <P>SOLUTION: A multistage high-frequency semiconductor module performing amplification by connecting a plurality of semiconductor amplification elements 7 and 8 in series comprises monitor circuits, in circuit boards 4, 5, and 6 disposed in a package 3, for monitoring a high-frequency signal between stages of the semiconductor amplification elements 7 and 8. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012151274(A) 申请公布日期 2012.08.09
申请号 JP20110008789 申请日期 2011.01.19
申请人 TOSHIBA CORP 发明人 MORIYA OSAMU;SENJU TOMOHIRO
分类号 H01L23/12;H01L21/822;H01L25/04;H01L25/18;H01L27/04;H03F3/19 主分类号 H01L23/12
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