发明名称 BINDER RESIN COMPOSITION FOR ELECTRODE, ELECTRODE MIXTURE PASTE, AND ELECTRODE
摘要 The present invention relates to a binder resin composition for an electrode, including a polyamic acid and a solvent, wherein the polyamic acid is (i) a polyamic acid which includes a tetracarboxylic acid component including 10 to 100 mol% of 4,4'-oxydiphthalic acid and 90 to 0 mol% of 3,3',4,4'-biphenyltetracarboxylic acid and/or pyromellitic acid and a diamine component including an aromatic diamine having 1 to 4 aromatic rings, (ii) a polyamic acid which includes a tetracarboxylic acid component including 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and a diamine component including 10 to 90 mol% of p-phenylene diamine and 90 to 10 mol% of 4,4'-diaminodiphenyl ether, or (iii) a polyamic acid which includes a tetracarboxylic acid component including 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and a diamine component including 40 mol% or more of a bis[4-(4-aminophenoxy)phenyl] compound.
申请公布号 EP2485307(A1) 申请公布日期 2012.08.08
申请号 EP20100820427 申请日期 2010.09.22
申请人 UBE INDUSTRIES, LTD. 发明人 NAKAYAMA, TAKESHIGE;NAKAYAMA, TOMONORI;TAKABAYASHI, SEIICHIROU;HIRANO, TETSUJI
分类号 H01M4/62;H01G11/28;H01G11/30;H01G11/38;H01M4/133;H01M4/134;H01M4/1393;H01M4/1395;H01M10/0525 主分类号 H01M4/62
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