发明名称 Honeycomb structure-forming die and method for manufacturing the same
摘要 A honeycomb structure-forming die 1 has a die substrate 22 including a first plate-shaped member 23 having back holes 6 for introducing a raw forming material and a second plate-shaped member 24 having slits 5 for forming the material into a lattice shape. The first plate-shaped member 23 has columnar portions 8 where at least a part is zoned by a slit-shaped groove portion 7 corresponding with a shape of the slit 5 on a bonding face side 28 where the first plate-shaped member 23 is bonded with the second plate-shaped member 24. In the columnar portions 8, the ratio (L/T) of the height L of the columnar portions 8 to the minimum width T in an end face on the bonding face side 28 is within 1/3 to 3.5. Thus constituted die realizes high formability, and two plate-shaped members constituting the die substrate are hardly peeled from each other.
申请公布号 US8235699(B2) 申请公布日期 2012.08.07
申请号 US20090393459 申请日期 2009.02.26
申请人 NGK INSULATORS, LTD. 发明人 TAKAHASHI HIRONORI;HOSOKAWA HIROFUMI
分类号 B29C47/20 主分类号 B29C47/20
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