| 发明名称 |
Electronic Component and Method for Producing an Electronic Component |
| 摘要 |
An electronic component having an encapsulation which has at least two double layers is described. In addition, a method for producing an electronic component in which a layer sequence is encapsulated is described.
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| 申请公布号 |
US2012193816(A1) |
申请公布日期 |
2012.08.02 |
| 申请号 |
US201013375207 |
申请日期 |
2010.05.28 |
| 申请人 |
SCHMID GUENTER;HUNZE ARVID |
发明人 |
SCHMID GUENTER;HUNZE ARVID |
| 分类号 |
H01L23/28;H01L21/56 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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