| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a multilayer circuit board having less warpage even when left in a high-temperature environment and having neither detachment nor void in the multilayer circuit board in a multilayer wiring circuit board formed by single-sided lamination, and to provide a multilayer circuit board and a semiconductor device having no detachment between multilayer circuit boards and having less warpage in a step of mounting a semiconductor element and in a step of performing a reliability test after mounting the semiconductor element. <P>SOLUTION: A single-sided lamination multilayer circuit board is formed by a plurality of sets of a conductor circuit layer and an insulating layer, and a solder resist layer, and includes no core board with a through hole conducted and connected by via connection. A glass-transition temperature of the insulating layer is 170°C or more, and a linear expansion coefficient of the same equal to or less than the glass-transition temperature is 35 ppm or less, and an elastic modulus of the same is 5 GPa or more. A glass-transition temperature of the solder resist layer is 160°C or more, and a linear expansion coefficient of the same equal to or less than the glass-transition temperature is 50 ppm or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
