ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

[Objective] To manufacture an electronic device while suppressing deterioration of resin substrates and an electronic element to a minimum. [Constitution] Low melting point metal layers (7 and 7') are provided to seal electronic elements (3 through 5) between a pair of resin substrates (1 and 1') having barrier layers (2 and 2') laminated thereon, and the barrier layers (2 and 2') are bonded to each other. Light absorbing layers (6 and 6') are provided between the barrier layers (2 and 2') and the low melting point metal layers (7 and 7'). A laser beam having a wavelength within a range from 350nm to 600nm is irradiated onto the light absorbing layer (6) through the resin substrate (1') and the barrier layer (2'), to heat and fuse the low melting point metal layers (7 and 7'), thereby bonding the barrier layers (2 and 2').