A mold clamping device includes a first fixed member to which a stationary mold is to be attached; a first movable member to which a movable mold is to be attached; a second movable member configured to move together with the first movable member; a second fixed member provided between the first movable member and the second movable member; a mold clamping force generating mechanism configured to generate a mold clamping force due to an electromagnetic force between the second movable member and the second fixed member; and a mold clamping force amplifying mechanism configured to amplify the mold clamping force generated by the mold clamping force generating mechanism.
