发明名称 |
Liquid resin composition for electronic components and electronic component device |
摘要 |
The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent. |
申请公布号 |
US8232355(B2) |
申请公布日期 |
2012.07.31 |
申请号 |
US20060094838 |
申请日期 |
2006.11.24 |
申请人 |
TAKAHASHI HISATO;TSUKAHARA HISASHI;TOMITA KYOUICHI;HAGIWARA SHINSUKE;HITACHI CHEMICAL CO., LTD. |
发明人 |
TAKAHASHI HISATO;TSUKAHARA HISASHI;TOMITA KYOUICHI;HAGIWARA SHINSUKE |
分类号 |
C08F283/12;C08F283/10;C08G77/04;C08G77/38;C08L63/00;C08L83/02 |
主分类号 |
C08F283/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|