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发明名称
电路板及其制作方法
摘要
本发明涉及一种电路板之制作方法,包括步骤:提供基板、覆盖层及胶层,该基板包括产品区域与非产品区域;于基板之非产品区域形成复数沿产品区域延伸之第一热交换槽,于覆盖层形成第二热交换槽,于胶层形成第三热交换槽,且使第二热交换槽、第三热交换槽均与第一热交换槽相对应;压合胶层、覆盖层与基板以形成电路板。本发明还涉及采用上述方法制作之电路板。
申请公布号
TWI369165
申请公布日期
2012.07.21
申请号
TW097140880
申请日期
2008.10.24
申请人
鸿胜科技股份有限公司 桃园县大园乡三和路28巷6号
发明人
王姗姗;李文钦
分类号
H05K3/46
主分类号
H05K3/46
代理机构
代理人
主权项
地址
桃园县大园乡三和路28巷6号
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