发明名称 |
HIGH STRENGTH AND HIGH ELECTRIC CONDUCTIVE MULTI-LAYER COPPER SHEETS AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PURPOSE: A multi-layered nanocrystalline copper alloy plate with high strength and electric conductivity and a manufacturing method thereof are provided to obtain various conductivity and high tensile strength through repeated ARB(Accumulative Roll-Bonding). CONSTITUTION: A method for manufacturing a multi-layered nanocrystalline copper alloy plate(10) with high strength and electric conductivity is as follows. A plate made of an OFC(Oxygen Free Copper) alloy(12) and DLP(Deoxidized Low-Phosphorous copper) alloy(14) is formed. A surface of the plate is processed. The multi-layered nanocrystalline copper alloy plate with more than 85IACS(%) conductivity and 400MPa tensile strength is formed by repeatedly roll-bonding the plate. |
申请公布号 |
KR20120081688(A) |
申请公布日期 |
2012.07.20 |
申请号 |
KR20110002941 |
申请日期 |
2011.01.12 |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
KIM, HYOUNG WOOK;LIM, CHA YONG |
分类号 |
B23K20/04 |
主分类号 |
B23K20/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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