发明名称 HIGH STRENGTH AND HIGH ELECTRIC CONDUCTIVE MULTI-LAYER COPPER SHEETS AND MANUFACTURING METHOD OF THE SAME
摘要 PURPOSE: A multi-layered nanocrystalline copper alloy plate with high strength and electric conductivity and a manufacturing method thereof are provided to obtain various conductivity and high tensile strength through repeated ARB(Accumulative Roll-Bonding). CONSTITUTION: A method for manufacturing a multi-layered nanocrystalline copper alloy plate(10) with high strength and electric conductivity is as follows. A plate made of an OFC(Oxygen Free Copper) alloy(12) and DLP(Deoxidized Low-Phosphorous copper) alloy(14) is formed. A surface of the plate is processed. The multi-layered nanocrystalline copper alloy plate with more than 85IACS(%) conductivity and 400MPa tensile strength is formed by repeatedly roll-bonding the plate.
申请公布号 KR20120081688(A) 申请公布日期 2012.07.20
申请号 KR20110002941 申请日期 2011.01.12
申请人 KOREA INSTITUTE OF MACHINERY & MATERIALS 发明人 KIM, HYOUNG WOOK;LIM, CHA YONG
分类号 B23K20/04 主分类号 B23K20/04
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