| 摘要 |
Disclosed is a semiconductor device capable of reliable laser beam welding of multiple lead frames with low variability and capable of improving camera visibility to reduce errors in detecting the planned weld positions. By aligning the direction of rolling seams (19) (the rolling direction) of each lead frame (10, 11), uniformity in absorption of the laser beam (14) can be achieved in the lead frames (10, 11) and variation in the laser beam welding in the lead frames (10, 11) can be reduced. As a result, it is possible to reduce the number of welds and manufacturing costs. Further, by aligning the direction of the rolling seams (19) (the rolling direction) of each lead frame (10, 11), since the variation in the intensity of the light reflected from the lead frames (10, 11) can be decreased, visibility of the camera (25) can be improved and errors in detection of the planned weld positions can be reduced. |
