| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal patterning method performing exposure, development and etching of a circuit pattern after a photocrosslinking resin layer is formed on a substrate and subjected to thinning with an organic alkaline aqueous solution which allows for uniform thinning even of a photocrosslinking resin layer where the photocrosslinking resin has a composition less susceptible to swelling with high productivity, and in-plane uniform and fine metal patterning. <P>SOLUTION: A metal patterning method includes a step for forming a photocrosslinking resin layer on a substrate, a step for thinning the photocrosslinking resin layer with an alkaline aqueous solution containing an organic alkaline compound, and exposure, development and etching steps of a circuit pattern in this order. <P>COPYRIGHT: (C)2012,JPO&INPIT |
