发明名称 |
Method for making semiconductor package |
摘要 |
A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not require any clamping pressure be simultaneously applied to the package. The rapid cooling step reduces a temperature of the encapsulation material from a curing temperature to the cooled temperature within a maximum period of less than five minutes. By using rapid cooling, as opposed to cooling the package under a clamping pressure with ambient air, package warpage due to CTE mismatches is prevented. |
申请公布号 |
US8216886(B2) |
申请公布日期 |
2012.07.10 |
申请号 |
US201113004029 |
申请日期 |
2011.01.11 |
申请人 |
TIAN BIN;XU NAN;YAO JINZHONG;FREESCALE SEMICONDUCTOR, INC. |
发明人 |
TIAN BIN;XU NAN;YAO JINZHONG |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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