发明名称 POLISHING SLURRY INCLUDING ZIRCONIA PARTICLES AND A METHOD OF USING THE POLISHING SLURRY
摘要 A polishing slurry can include zirconia particles. The polishing slurry can be used to polish conductive and insulating materials, and is particularly well suited for polishing oxide materials as well as metals. The characteristics of the zirconia particles can affect the polishing of workpieces. By selecting the proper characteristics, the polishing slurry can have a good material removal rate while still providing an acceptable surface finish. The zirconia particles can be used as a replacement for, or in conjunction with, ceria or other abrasive particles. The content of zirconia particles in the polishing slurry may be less than a comparable polishing slurry having silica or alumina particles.
申请公布号 US2012171936(A1) 申请公布日期 2012.07.05
申请号 US201113338753 申请日期 2011.12.28
申请人 HAERLE ANDREW G.;WANG JUN;WISS FREDERIC;SAINT-GOBAIN CERAMICS & PLASTICS, INC. 发明人 HAERLE ANDREW G.;WANG JUN;WISS FREDERIC
分类号 B24B1/00;B32B9/00;C09G1/02 主分类号 B24B1/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利