| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce damage to a pattern on a substrate due to substrate processing when a substrate surface is processed. <P>SOLUTION: A substrate processing apparatus is provided according to an embodiment. The substrate processing apparatus comprises a substrate supporting portion which fixes and supports a substrate from the back side of a surface to be processed. The substrate processing apparatus also comprises a substrate processing portion in which a pad for soaking a predetermined liquid is disposed and which performs substrate processing for the surface to be processed of the substrate with the liquid. When the substrate processing is performed, the substrate supporting portion supporting the substrate is moved closer to the pad side. The surface to be processed of the substrate is made in contact with the liquid in the pad surface without rotating the substrate and the pad. In this way, the substrate processing is performed without rotating the substrate and the pad. <P>COPYRIGHT: (C)2012,JPO&INPIT |
