发明名称 METHOD FOR HOLDING SUBSTRATE AND SUBSTRATE HOLDING SYSTEM
摘要 PURPOSE: A method for holding a substrate is provided to reduce the quantity of foreign substances on the back surface of a substrate and decrease foreign substances transferred from an install unit to the substrate, by making the substrate contact the cooling surface at the ring-shaped leakage-proof surface, by placing the contact holding portion on a position inside the ring-shaped leakage-proof surface and by allowing the back surface of the substrate not to contact the cooling surface in the large portion of the remaining area. CONSTITUTION: The ring-shaped leakage-proof surface has a smooth surface on the specimen table corresponding to the periphery of the substrate(1). A plurality of contact holding portions confront the substrate on the specimen table between a position corresponding to the periphery of the substrate and a position corresponding to the center of the substrate. An electrostatic attraction unit fixes the substrate by making the back surface of the substrate contact the ring-shaped leakage-proof surface.
申请公布号 KR100362995(B1) 申请公布日期 2002.11.18
申请号 KR20000058873 申请日期 2000.10.06
申请人 HITACHI, LTD. 发明人 TAKAHASHI KAZUE;OGAWA YOSHIFUMI;ITO YOUICHI;TAMURA NAOYUKI;SHICHIDA HIROYUKI;TSUBONE TSUNEHIKO
分类号 H01L21/00;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 H01L21/00
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