发明名称 |
METHOD FOR HOLDING SUBSTRATE AND SUBSTRATE HOLDING SYSTEM |
摘要 |
PURPOSE: A method for holding a substrate is provided to reduce the quantity of foreign substances on the back surface of a substrate and decrease foreign substances transferred from an install unit to the substrate, by making the substrate contact the cooling surface at the ring-shaped leakage-proof surface, by placing the contact holding portion on a position inside the ring-shaped leakage-proof surface and by allowing the back surface of the substrate not to contact the cooling surface in the large portion of the remaining area. CONSTITUTION: The ring-shaped leakage-proof surface has a smooth surface on the specimen table corresponding to the periphery of the substrate(1). A plurality of contact holding portions confront the substrate on the specimen table between a position corresponding to the periphery of the substrate and a position corresponding to the center of the substrate. An electrostatic attraction unit fixes the substrate by making the back surface of the substrate contact the ring-shaped leakage-proof surface. |
申请公布号 |
KR100362995(B1) |
申请公布日期 |
2002.11.18 |
申请号 |
KR20000058873 |
申请日期 |
2000.10.06 |
申请人 |
HITACHI, LTD. |
发明人 |
TAKAHASHI KAZUE;OGAWA YOSHIFUMI;ITO YOUICHI;TAMURA NAOYUKI;SHICHIDA HIROYUKI;TSUBONE TSUNEHIKO |
分类号 |
H01L21/00;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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