发明名称 SPLITTING METHOD OF SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To condense a laser beam sufficiently in a substrate when the substrate is split by irradiating the interior of the substrate having a through electrode with a laser beam and forming a modified layer. <P>SOLUTION: The splitting method of a substrate 1 includes an electrode heading step for projecting an upper surface 4a of a through electrode 4 from a surface 1a of the substrate 1 by removing the surface 1a of the substrate 1 having the through electrode 4 by etching, a modified layer formation step for forming a modified layer 5 in the substrate 1 by condensing a laser beam L having a wavelength transmitting through the substrate 1 along a scheduled split line 2, and a split step for splitting the substrate 1 along the scheduled split line 2 by applying an external force to the modified layer 5 after the electrode heading step and modified layer formation step. The electrode heading step is performed after the modified layer formation step. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012129430(A) 申请公布日期 2012.07.05
申请号 JP20100281166 申请日期 2010.12.17
申请人 DISCO ABRASIVE SYST LTD 发明人 NAKAMURA MASARU
分类号 H01L21/301;B23K26/38;B23K26/40 主分类号 H01L21/301
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