发明名称 |
RESIN FOR TRANSPARENT ENCAPSULATION MATERIAL, AND ASSOCIATED ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE |
摘要 |
A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.
|
申请公布号 |
US2012168780(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
US201113339510 |
申请日期 |
2011.12.29 |
申请人 |
|
发明人 |
CHA SUNG-HWAN;KOH SANG-RAN;KIM YONG KOOK;KIM WOO-HAN;KIM HA NEUL;AN CHI WON |
分类号 |
H01L33/00;C08G77/20;H01L31/0203 |
主分类号 |
H01L33/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|