| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor element sealing body and a manufacturing method of a semiconductor package which simultaneously manufacture multiple packages, each of which includes a semiconductor element and secures electrical connection between an upper part and a lower part, and manufacture the packages with high reliability. <P>SOLUTION: A manufacturing method of a semiconductor element sealing body of this invention is a method for manufacturing a semiconductor element sealing body 270 having semiconductor elements 26, conductor pillars 28, and a sealing part 27 sealing the semiconductor elements 26 and the conductor pillars 28. The manufacturing method includes: a placement process in which the semiconductor elements 26 are placed on a dummy substrate 101; a sealing part formation process in which the sealing part is formed by an insulation material having photosensitivity; a conductor pillar formation process in which through holes 271 are formed in the sealing part 27 using a photo-lithography method, and then the conductive pillars 28 are formed in the through holes 271 to obtain the semiconductor element sealing body 270 on the dummy substrate 101; and a removal process in which the dummy substrate 101 is removed from the semiconductor element sealing body 270. <P>COPYRIGHT: (C)2012,JPO&INPIT |
