| 摘要 |
PURPOSE: An apparatus for controlling a chip mounting position on a tape for an ILB process in a semiconductor chip packaging process is provided to reduce ILB(Inner Lead Bonding) process time by decreasing the alignment mark recognition time of a camera. CONSTITUTION: A probe camera(70) comprises a bonding tool(10), a bottom camera, and a top camera. A boning tool grips a chip(30) on a tape(20) for an ILB. The bottom camera recognizes a plurality of alignment marks on the tape. The top camera recognizes a plurality of alignment marks on the chip gripped by the bonding tool. A control unit controls the position of the bonding tool.
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