发明名称 POLYAMIDE-BASED RESIN COMPOSITION WITH LOW THERMAL EXPANSION COEFFICIENT
摘要 PURPOSE: A polyamide-based resin composition is provided to have constant impact strength and to lower coefficient of thermal expansion. CONSTITUTION: A polyamide-based resin composition comprises polyamide, inorganic filler, polyphenylene sulfide, and nano-filler. The inorganic filler is dispersed in polyamide. The nano-filler is dispersed in polyphenylene sulfide. The polyamide is selected from polycaprolactam, poly(11-aminoundecanoic acid), polylauryl lactam, polyhexamethylene adipamide, polyhexaethylene azelamide, polyhexaethylene sebacamide, polyhexa ethylene dodecandiamide, copolymer and mixture thereof.
申请公布号 KR20120069798(A) 申请公布日期 2012.06.29
申请号 KR20100131098 申请日期 2010.12.21
申请人 CHEIL INDUSTRIES INC. 发明人 HUH, JIN YOUNG;HA, DOO HAN
分类号 C08L77/00;C08K3/34;C08L71/12;C08L81/04 主分类号 C08L77/00
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