| 发明名称 |
METHOD FOR MANUFACTURING MOUNTED PRODUCT FOR SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a mounted product for a semiconductor device that can quickly manufacture the mounted product at a low cost without causing an increase in process time and an increase in device cost. <P>SOLUTION: In the method for manufacturing the mounted product for the semiconductor device including: a step for preparing two components for mounting to be used in the semiconductor device; a step for imparting a photosensitive adhesive composition to a surface for adhesion of one of the two components; a step for exposing the adhesive imparted surface for development to be formed into a prescribed pattern; and a step for producing the mounted product by adhering the two components for mounting to each other by using the pattern-formed adhesive imparted surface, a special photosensitive adhesive composition and special developing solution are used. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012113056(A) |
申请公布日期 |
2012.06.14 |
| 申请号 |
JP20100260385 |
申请日期 |
2010.11.22 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
SUGIMOTO NAOYA;YAMAGUCHI YOSHIO |
| 分类号 |
G03F7/32;C09J11/06;C09J163/00;C09J175/16;G03F7/004;G03F7/027;H01L23/10 |
主分类号 |
G03F7/32 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
