发明名称 DEVICE AND METHOD FOR SEPARATING THIN WAFER FROM SUBSTRATE
摘要 An apparatus and a method of separating a substrate are provided to save energy by separating a growth layer from a growth substrate in a separating chamber under the atmosphere of low pressure or vacuum. A method of separating a substrate includes the steps of: providing a growth substrate(10) and a growth layer(20), which is coupled with each other, to a separating chamber(110) having a light transmitting unit(112); maintaining the inside of the separating chamber as the atmosphere of high temperature and low pressure; and separating the growth layer and the growth substrate from the inside of the separating chamber by irradiating laser through the light transmitting unit.
申请公布号 KR101117266(B1) 申请公布日期 2012.06.12
申请号 KR20060070410 申请日期 2006.07.26
申请人 发明人
分类号 H01L21/301 主分类号 H01L21/301
代理机构 代理人
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