发明名称 PROCESSING METHOD OF WORK AND DICING TAPE
摘要 <P>PROBLEM TO BE SOLVED: To prevent an adhesive surface of a dicing tape from getting stuck to a holding surface of a holding table, in the process of converging laser beams from the back surface side of a work over the dicing tape stuck to an annular frame. <P>SOLUTION: A back surface 11 of a work 1 is stuck to an adhesive surface 20 of a dicing tape 2, the work 1 is supported at an opening of an annular frame 3 stuck to the dicing tape 2, and annular release paper 4 is stuck to the adhesive surface 20 of the dicing tape 2 corresponding to an area between an outer periphery 12 of the work 1 and an inner periphery 31 of the annular frame 3. In the state, a surface 10 of the work 1 is held by a holding table 6, the laser beam of a wavelength to be transmitted through the work 1 is radiated from the side of the back surface 11 of the work 1, and a modified layer is formed along a division scheduled line inside the work 1. After peeling the release paper 4 from the adhesive surface 20, the dicing tape 2 is extended and the work 1 is divided. Since the release paper 4 is stuck to the adhesive surface 20 of the dicing tape 2, the adhesive surface 20 is not brought into contact with the holding table 6. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012109338(A) 申请公布日期 2012.06.07
申请号 JP20100255689 申请日期 2010.11.16
申请人 DISCO ABRASIVE SYST LTD 发明人 WATANABE YOSUKE;NOMURA HIROSHI
分类号 H01L21/301 主分类号 H01L21/301
代理机构 代理人
主权项
地址