| 摘要 |
PURPOSE: A sealing composition for sealing an organic electronic device is provided to have improved the durability and the life time of an organic electronic device using the same, because of excellent adhesion, shock resistance, heat radiation ability, and moisture-shielding ability. CONSTITUTION: A sealing composition for sealing an organic electronic device comprises: 100 parts by weight of solid phase or semisolid phase curable adhesive resin, 1-100 parts by weight of a moisture absorbent, and 1-50 parts by weight of a filler. The viscosity of the curable adhesive resin at room temperature is 10^6 poise or higher. In the state of being cured to the shape of a film with the thickness of 80 um, the moisture permeability along transverse direction of the curable adhesive resin is 50 g/m^2 day or less. The curable adhesive resin is an epoxy resin. The curable adhesive resin is silane-modified epoxy resin. The moisture absorbent is oxide or metal. The filler is one or more selected from a group consisting of clay, talc, silica, alumina, and titian. |
