| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, a semiconductor assembly member, and a manufacturing method of the semiconductor device which easily manufacture various on-resistance elements. <P>SOLUTION: A semiconductor device according to an embodiment includes element parts, first electrode parts, second electrode parts, and extended parts. The element parts are provided on a substrate. The first electrode parts are respectively provided on the element parts and establish electrical continuity with the element parts. The second electrode parts are respectively provided on the element parts so as to be spaced apart from the first electrode parts and establish electrical continuity with the element parts. The extended parts are provided on the element parts so as to extend from peripheral parts of the first electrode parts and the second electrode parts toward a peripheral part of the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
