CHIP COMPRISING INCLINED CONDUCTIVE BUMP AND ITS FABRICATION METHOD AND FABRICATION METHOD OF ELECTRONIC APPLICATION HAVING THE SAME

摘要

PURPOSE: A chip with a slanted conductive bump, an electronic part including the chip, and a manufacturing method thereof are provided to restrict excessive deformation of the conductive bump, thereby preventing conductive bump destruction. CONSTITUTION: One or more pads(210) are arranged on the surface of a chip(200) including a conductive bump. A plurality of first slanted conductive bumps(220) is arranged on the upper surface of the pad. A plurality of second slanted conductive bumps(230) is arranged on the surface of the chip adjacent to the pad. The first and second slanted conductive bumps have a cylindrical structure slanted with a fixed angle(Θ). A polymer layer(240) fills the circumference of the first and second slanted conductive bumps.