| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an element substrate which is free of shorting defects when joined by soldering with a component mounting circuit board and thus exhibits improved strength of solder joints and a highly reliable light-emitting device using such an element substrate. <P>SOLUTION: The element substrate comprises a substrate body 2 which is composed of an inorganic insulating material and part of which has a mounting plane serving as a mounting portion on which a light-emitting device 11 will be mounted and a wiring conductor which is formed on the surface and inside of the substrate body so as to electrically connects electrodes of the light-emitting device to an external circuit and part of which is disposed as a plurality of external connection terminals 5 on a non-mounting plane, or a surface on the opposite side of the mounting plane, the external connection terminals being joined by soldering to wiring circuits of the circuit board. On the non-mounting plane of the substrate body, in a region between one of the external connection terminals and another external connection terminal opposed to that external connection terminal, is formed a solder adhesion prevention layer 6 which is composed of an inorganic insulating material containing glass as its primary ingredient and has a surface roughness Ra of 0.03 μm or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
