| 摘要 |
A multi-layered printed circuit board (1) including conductive test areas (7) on at least one inner layer (2) for determining a possible misalignment of an inner layer, or a misalignment of an inner layer structuring, respectively, wherein the conductive test areas include ring structures (7.i) arranged in rows and defining inner, non-conductive areas (8.i) of various sizes, and having through-contacting bore holes (5) in the region of the rest areas (7). |
