| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroconductive resin composition giving its cured product of high thermal conductivity, good in adhesive strength and excellent in workability as well, and to provide a highly reliable semiconductor device using such an electroconductive resin composition. <P>SOLUTION: The electroconductive resin composition essentially comprises: (A) an epoxy resin based on a flexible epoxy resin with an epoxy equivalent of 200-2,000; (B) a curing agent; (C) a curing promoter; and (D) silver powder; wherein (D) the silver powder is characterized by containing, based on 100 pts.mass of the total amount thereof, (d1) 60 pts.mass or more of amorphous silver powder and (d2) 30 pts.mass or more of flaky silver powder. A semiconductor device using the electroconductive resin composition is also provided. <P>COPYRIGHT: (C)2012,JPO&INPIT |
