发明名称 LED PACKAGE STRUCTURE
摘要 The present invention provides an LED package structure which has a housing, a first electrode plate, a second electrode plate, a LED chip and a Zener diode. The LED chip is mounted in the recess, and a first electrode and a second electrode of the LED chip are electrically connected to the first electrode plate and the second electrode plate, respectively. The Zener diode is embedded in the housing, and a second electrode and a first electrode of the Zener diode is electrically connected to the first electrode plate and the second electrode plate, respectively. The Zener diode of the present invention is embedded in the housing, so that it can prevent from affecting the luminous flux of the LED chip.
申请公布号 US2012112237(A1) 申请公布日期 2012.05.10
申请号 US20100997915 申请日期 2010.11.29
申请人 ZHENG WEIWEI;HU CHECHANG;SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO. LTD. 发明人 ZHENG WEIWEI;HU CHECHANG
分类号 H01L33/48 主分类号 H01L33/48
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