发明名称 MANUFACTURING METHOD OF ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic apparatus which enables electronic components to be attached easily to a support medium. <P>SOLUTION: A housing (support medium) 11 is composed of a rectangular bottom plate part 21, four side surface plates (a rear plate part 23, a left plate part 25, a front plate part 27, and a right plate part 29) located adjacent to the bottom plate part 21, and an upper plate part 31 located adjacent to the right plate part 29 and facing the bottom plate part 21 when the housing is assembled. Folded parts 33, 35, 37, and 39 are respectively provided between the bottom plate part 21 and the four side surface plates. Further, a folded part 41 is provided between the right plate part 29 and the upper plate part 31. First, circuit boards 51, 53, 55, a transistor 61, a connector 15, a discharge lamp 13 are attached to the expanded housing 11 in which the folded parts have not been folded. Then, the expanded housing 11 is folded so as to be formed in a box shape. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012089671(A) 申请公布日期 2012.05.10
申请号 JP20100234839 申请日期 2010.10.19
申请人 DENSO CORP 发明人 KUROSAKI HIROTAKA
分类号 H05K5/02;H05K7/14 主分类号 H05K5/02
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