摘要 |
PURPOSE: A test pattern of a semiconductor device is provided to suppress the linewidth variation of a test line on a contact point connecting part of a probe pad and a test line. CONSTITUTION: Two probe pads(110) are faced to each other. A test line(120) is connected to the probe pads. A plurality of dummy lines(130) is separately placed on the side of the test line, and the end thereof is connected by the probe pads. The dummy line has a disconnected part and has the shape of the teeth of combs facing to each other.
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