发明名称 Plasma Etch Resistant, Highly Oriented Yttria Films, Coated Substrates and Related Methods
摘要 Included within the scope of the invention are plasma etch-resistant films for substrates. The films include a yttria material and a at least a portion of the yttria material is in a crystal phase having an orientation defined by a Miller Index notation {111}. Also included are methods of manufacturing plasma etch-resistant films on a substrate. Such methods include applying a yttria material-containing composition onto at least a portion of a surface of a substrate to form a film. The film includes a yttria material and at least a portion of the yttria material is in a crystal phase having an orientation defined by a Miller Index notation {111}.
申请公布号 US2012103519(A1) 申请公布日期 2012.05.03
申请号 US201113280129 申请日期 2011.10.24
申请人 AHEEM MOHAMMED;LEE SANG-HO;MERCER THOMAS;VORSA VASIL;GREENE, TWEED OF DELAWARE, INC. 发明人 AHEEM MOHAMMED;LEE SANG-HO;MERCER THOMAS;VORSA VASIL
分类号 H01L21/00;B05D5/00;B44C1/22;C23C4/12;C23C14/34;C23C16/48 主分类号 H01L21/00
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