| 摘要 |
PURPOSE: A bonding apparatus and a bonding unit and a bonding method are provided to improve a processing amount in substrate bonding by efficiently controlling the temperatures of substrates having a metal boding part. CONSTITUTION: A heat processing unit(20) includes a first thermal processing plate on which a polymerization wafer is loaded and thermally processed. A bonding unit includes a second thermal processing plate and a pressure mechanism(80). The first thermal processing plate includes a coolant flow path(44) cooling the polymerization wafer on the first thermal processing plate. The heat processing unit and the boding unit reduce atmosphere inside to a certain degree of vacuum. The heat processing unit includes a plurality of transport apparatuses carrying a wafer from the boding unit.
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