发明名称 |
Tin plating solution |
摘要 |
To provide a tin plating solution having uniformity of through-hole plating, uniformity of film thickness distribution and no burn deposits even. The tin plating solution include a tin ion source, at least one non-ionic surfactant, imidazoline dicarboxylate and 1,10-phenanthroline. |
申请公布号 |
EP2444527(A2) |
申请公布日期 |
2012.04.25 |
申请号 |
EP20110185970 |
申请日期 |
2011.10.20 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
HAYASHI, SHINJIRO;SAKAI, MAKOTO |
分类号 |
C25D3/32;H05K3/06;H05K3/24 |
主分类号 |
C25D3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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