发明名称 Airflow recirculation and cooling apparatus and method for an electronics rack
摘要 An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold.
申请公布号 US8164897(B2) 申请公布日期 2012.04.24
申请号 US20100708792 申请日期 2010.02.19
申请人 GRAYBILL DAVID P.;IYENGAR MADHUSUDAN K;NEWCOMER JEFFREY A.;SCHMIDT ROGER R.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 GRAYBILL DAVID P.;IYENGAR MADHUSUDAN K;NEWCOMER JEFFREY A.;SCHMIDT ROGER R.
分类号 H05K7/20;F28F7/00 主分类号 H05K7/20
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