| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a machining method for forming a division-starting point on a workpiece by which optical absorption in a machining trace is reduced, efficiency of taking out light from sapphire is enhanced and high-speed processing can be performed, and to provide a laser beam machining apparatus for materializing the machining method. <P>SOLUTION: The workpiece is irradiated with a pulsed laser beam in such a manner that an irradiation region for each unit pulsed beam of an ultrashort pulsed laser beam is formed discretely on the workpiece. By an impact or stress caused by irradiating an irradiation position with each unit pulsed beam, cleavage or parting of the workpiece is successively generated between the irradiation regions, thus forming a division-starting point on the workpiece. <P>COPYRIGHT: (C)2012,JPO&INPIT |
