| 摘要 |
Disclosed is a device that positions a first substrate , which has a wiring/electrode pattern formed on the surface thereof, and a second substrate, which has a wiring/electrode pattern formed on the surface thereof, such that the wiring/electrode patterns on the substrates face each other, and then bonds the substrates together. The disclosed device is provided with: a means for holding the second substrate; a means for bending the held second substrate; and a means for bringing the first substrate and the second substrate close to each other, one of said substrates being coated with a curable resin, and pressing the second substrate towards the first substrate. The disclosed device and method minimize the amount of curable resin coating while preventing the incorporation of voids and increasing the contact area between opposing wiring/electrode patterns with respect to the comparatively large total surface area of the substrates on which wiring/electrode patterns are formed. |
