发明名称 SUBSTRATE FOR SUSPENSION, MANUFACTURING METHOD OF SUBSTRATE FOR SUSPENSION, SUSPENSION, SUSPENSION WITH ELEMENT, AND HARD DISK DRIVE
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate for suspension, which can prevent short circuit caused by a solder bridge in performing solder connection, and which is stably connectable to an external circuit by soldering. <P>SOLUTION: An inventive substrate for suspension has a metallic support substrate, a base insulating layer formed on the metallic support substrate, wiring conductor patterns formed on the base insulating layer, external connection terminals formed on the base insulating layer and connected to the wiring conductor patterns respectively, and barriers each formed between two adjacent external connection terminals. The barrier includes a barrier conductor pattern formed on the base insulating layer and a barrier cover insulation layer formed so as to cover the barrier conductor pattern, and the height of the barrier is larger than the height of the external connection terminal. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012079375(A) 申请公布日期 2012.04.19
申请号 JP20100222606 申请日期 2010.09.30
申请人 DAINIPPON PRINTING CO LTD 发明人 YAMAKAWA KEIJIRO
分类号 G11B21/21;G11B5/56;G11B5/60;H05K1/11;H05K3/28;H05K3/34 主分类号 G11B21/21
代理机构 代理人
主权项
地址