发明名称 Sensor assemblies
摘要 The invention relates to a sensor assembly. The assembly includes a multi-layer sensor body (2) of appropriate construction (preferably substantially ceramic). A preformed ceramic disc (8) is bonded to a front part of the sensor body (2) to provide a hermetic seal that excludes gas from any interface between the constituent layers of the sensor body (2). The hermetic seal is maintained even if the sensor assembly is used at high operating temperatures.
申请公布号 EP2442077(A1) 申请公布日期 2012.04.18
申请号 EP20100013529 申请日期 2010.10.12
申请人 FUTURE TECHNOLOGY (SENSORS) LTD 发明人 ELLIOT, HOWARD WINDRUSH
分类号 G01D11/24;H03K17/95 主分类号 G01D11/24
代理机构 代理人
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