| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin paste composition curable at 125°C or lower, excellent in bonding strength and free from bleeding out, and good in workability. <P>SOLUTION: The resin paste composition includes: (A) a compound selected from an acrylic ester compound and a methacrylic ester compound; (B) a peroxide represented by general formula (1) and having a 10 hour half-life period temperature of 60-80°C; (C) a flexibilizer; and (D) a filler containing a non-spherical filler and a spherical filler. In the formula, R represents a 1-10C alkyl group or a 2-acylperoxypropyl-2-yl alkylene group; and R<SP POS="POST">1</SP>represents a 3-10C alkyl group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
