发明名称 LIGHT-SENSITIVE RESIN COMPOSITION
摘要 The present invention relates to a light-sensitive resin composition, and more specifically has the advantages of outstanding storage stability, and also outstanding flexibility as a cured product even though the cured product maintains properties which are essential in a solder resist such as heat resistance and electrical-insulation reliability.
申请公布号 WO2012043983(A2) 申请公布日期 2012.04.05
申请号 WO2011KR06329 申请日期 2011.08.26
申请人 KOLON INDUSTRIES, INC.;BONG, DONG HUN 发明人 BONG, DONG HUN
分类号 G03F7/027;G03F7/004;G03F7/028;G03F7/032 主分类号 G03F7/027
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