| 摘要 |
The present invention pertains to a device for wafer alignment and a rear surface test, which is provided neighboring a wafer chuck so as to detect contaminants on a rear surface of a wafer while the wafer rotates by an orientor and the wafer chuck for the alignment of the wafer, so that a contaminated wafer may be detected and removed before the contaminated wafer is injected into a processing chamber. Therefore, it is possible to prevent damage to the processing chamber and the wafer and problems in processing due to the injection of the contaminated wafer. In addition, the detection of the contaminants on the rear surface of the wafer and the alignment of the wafer are simultaneously carried out so as to improve processing reliability and productivity. |
