MANUFACTURING METHOD OF WIRING BOARD AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board, capable of reducing the shift, from a desired pitch, of a pitch of an electrode pad electrically connected with a semiconductor chip.

SOLUTION: The manufacturing method of the wiring board includes: a process of forming a recess on the upper surface of a support substrate 11 comprising a material having a thermal expansion coefficient equal to that of a semiconductor substrate configuring a semiconductor chip; a process of forming a peeling layer on the upper surface of the support substrate; a process of forming a metal layer on the peeling layer; a process of forming a first insulation layer 16 on the metal layer; a process of forming a through-hole passing through the first insulation layer 16 so as to expose the metal layer at a position corresponding to the recess; a first wiring layer forming process of forming a first wiring layer 17 on the metal layer exposed inside the through-hole with the metal layer as a seed layer; a laminating process of laminating a wiring layer and an insulation layer further on the first wiring layer 17 and the first insulation layer 16; and a process of removing the support substrate 11 by executing prescribed processing to the peeling layer.

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