High-power semiconductor module with a base module and a connection module

摘要

The module (1) has a connection module (6) comprising an insulating body (60) with an internal connection assembly (40). The internal connection assembly forms an electric contact between contact units (24a, 26a) of a semiconductor component (4a) with contact units (24b, 26b) of another semiconductor component (4b). The connection module comprises external contact elements (154, 156), which are circuit-fairly indirectly or directly connected with one of the contact units or with the connection assembly over connecting units. An independent claim is also included for a method for manufacturing a power semiconductor module.