SEALED SUBSTRATE CARRIER FOR ELECTROPLATING

摘要

One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body (102 and 202) on which the substrates are held, and conductive lines (128) are embedded within the carrier body. A conductive bus bar (120) is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold (602) covers a portion of the bus bar, and there is a plastic-to-plastic bond (see 732) between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.