DEFECT INSPECTION METHOD AND APPARATUS THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a defect inspection apparatus and its method capable of high-sensitively detecting a critical defect existing in the vicinity of a direct peripheral circuit part in a chip formed on a semiconductor wafer.

SOLUTION: In the defect inspection apparatus including an illumination optical system for irradiating an object to be inspected under a predetermined optical condition and a detection optical system for detecting scattered light from the object to be inspected under a predetermined detection condition and acquiring image data, a plurality of different defects are determined in each region from a plurality of image data having respectively different optical conditions or image data acquisition conditions acquired by the detection optical system and determined results are combined to detect defect candidates.

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